Mendes, P. M. and Polyakov, A. and Bartek, M. and Burghartz, J. N. and Correia, J. H. (2003) Integrated chip-size antenna for wireless microsystems : fabrication and design considerations. In: UNSPECIFIED.
![[img]](http://bath.eprints.org/style/images/fileicons/application_pdf.png)
| PDF 690Kb |
Abstract
This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Two different fabrication options based on via formation in glass substrates using excimer laser ablation or powder blasting are presented.
| Item Type: | Conference or Workshop Item (UNSPECIFIED) |
|---|---|
| DSpace Citation: | EUROSENSORS, 17, Guimarães, 2003. - "Eurosensors XVII" [CD-ROM). Guimarães : Universidade do Minho. Departamento de Electrónica Industrial, 2003. p. 438-439. |
| Uncontrolled Keywords: | Chip-size antenna, Wafer level packaging, Wireless microsystem, Laser ablation, Powder blasting |
| Communities: | Departamento de Electrónica Industrial > DEI - Artigos em Actas de Congressos Internacionais |
| ID Code: | 1225 |
| Deposited By: | Leslie Carr |
| Deposited On: | 19 Apr 2009 18:15 |
| Last Modified: | 21 Apr 2009 14:51 |
Repository Staff Only: item control page
